MCP18480
DS20091B-page 50
?2003 Microchip Technology Inc.
20-Lead Plastic Shrink Small Outline (SS) 209 mil, 5.30 mm (SSOP)
10
5
0
10
5
0
?/DIV>
Mold Draft Angle Bottom
10
5
0
10
5
0
?/DIV>
Mold Draft Angle Top
0.38
0.32
0.25
.015
.013
.010
B
Lead Width
203.20
101.60
0.00
8
4
0
?/DIV>
Foot Angle
0.25
0.18
0.10
.010
.007
.004
c
Lead Thickness
0.94
0.75
0.56
.037
.030
.022
L
Foot Length
7.34
7.20
7.06
.289
.284
.278
D
Overall Length
5.38
5.25
5.11
.212
.207
.201
E1
Molded Package Width
8.18
7.85
7.59
.322
.309
.299
E
Overall Width
0.25
0.15
0.05
.010
.006
.002
A1
Standoff ?/DIV>
1.83
1.73
1.63
.072
.068
.064
A2
Molded Package Thickness
1.98
1.85
1.73
.078
.073
.068
A
Overall Height
0.65
.026
p
Pitch
20
20
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
D
p
n
B
E
E1
L
c
?/DIV>
?/DIV>
?/DIV>
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
?Significant Characteristic
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